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Since the introduction of Chip Scale Packages (CSP's) only a few short years ago, they have become one of the biggest packaging trends in recent history.
WLCSPisatruechip-scalepackaging(CSP)technology,sincetheresultingpackageisofthesamesizeofthedieasshowninFigure1.WLCSPtechnology ...
晶粒尺寸封裝(CSP：ChipScalePackage)又稱為「裸晶封裝(Barepackage)」，其實這應該算是一種對於封裝的定義，而不是一種封裝技術，我們定義封裝後體積只有晶片 ...
ChipScalePackage(CSP,engl.;zudeutschGehäuseinderGrößenordnungdesDie)isteinChipgehäusevonintegriertenSchaltungen,beidemdasGehäuse ...
Thesearecalledchip-scalepackages(CSP)andaredefinedaspackagesthatarenolargerthan1.5timestheareaofthedieornomorethan1.2timesthewidth ...
2.Young,J.,“MicroSMTPackaging,”atechnicalpaperbyChipScale,Inc.,.Sept.1996.3.Kasai,J.,“LowCostChipScale.PackageforMemoryProducts,”SMI.
Achipscalepackageorchip-scalepackage(CSP)isatypeofintegratedcircuitpackage.Originally,CSPwastheacronymforchip-sizepackaging.Sinceonlyafewpackagesarechipsize,themeaningoftheacronymwasadaptedtochip-...
ChipScalePackage,orCSP,basedonIPC/JEDECJ-STD-012definition,isasingle-die,directsurfacemountablepackagewithanareaofnomorethan1.2X ...
FCCSP(FlipChipChipScalePackage)offerschipscalecapacityforI/Osaround200orless.FCCSPprovidesbetterprotectionforchipandbettersolder ...
Thetermchip-scalepackagedescribesawafer-levelpackageddiewithsphericalbumpslocatedonagridwithapredefinedpitch.Figure3illustratesthese ...
Wafer-levelchipscalepackaging(WL-CSP)isthesmallestpackagecurrentlyavailableonthemarketandisproducedbyOSAT(OutsourcedSemiconductor ...
2022年4月13日—AChipScalePackage(CSP)isatypeofintegratedcircuit(IC)packagethatissurfacemountableandhasanareanotmorethan1.2times ...
Possessingasmallchipsize,theWafer-LevelChipScalePackage(WLCSP)solutionisoneofthemostcost-effectiveandspace-efficientpackagingoptionsin ...
晶片尺寸構裝（ChipScalePackage,CSP）是一種半導體構裝技術。最早CSP只是晶片尺寸封裝的縮寫。根據IPC的標準J-STD-012,"ImplementationofFlipChip ...
晶片尺寸構裝（ChipScalePackage,CSP）是一種半導體構裝技術。最早CSP只是晶片尺寸封裝的縮寫。根據IPC的標準J-STD-012,ImplementationofFlipChipandChip ...
晶粒尺寸封裝(CSP：ChipScalePackage)又稱為「裸晶封裝(Barepackage)」，其實這應該算是一種對於封裝的定義，而不是一種封裝技術，我們定義封裝後體積 ...
Chip-scalepackagingisamoreefficientformofpackagingthatreducestheresistance,inductance,size,thermalimpedance,andcostofpowertransistors, ...