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Cu-pillar bumping is a next-generation flip chip interconnection between chip & packages (FCBGA/FCCSP), especially for fine pitch applications.
銅柱凸塊(copperpillarbump，CPB)技術是在覆晶封裝晶片的表面製作焊接凸塊，使其具備導電、導熱和抗電子遷移能力的功能。不同於傳統的銲錫凸塊，每個散熱銅柱凸塊就 ...
ASE'sCupillarbumpsinflipchippackagingtechnologyisthemosteffectivemethodforfine-pitchinterconnectionforthesepackagetypes.Application.
ThetypicalbumpstructureofCupillarbumpisasbelow;bumpUBMwassputteredonPSV(SiNorPI)andCupostwithsoldertipformedbyplatingprocess.
Cu-pillarbumpingisanext-generationflipchipinterconnectionbetweenchip&packages(FCBGA/FCCSP),especiallyforfinepitchapplications.
CopperpillarbumpiswidelyusedformanytypesofflipchipinterconnectwhichoffersadvantagesinmanydesignswhilemeetingcurrentandfutureROHS ...
銅柱凸塊的精細凸塊間距可以達到小至50微米，因此提高了Flipchip在載板及模組的封裝能力。而無鉛凸塊（SnAg1.8％）則可以滿足RoHS和綠色產品要求。
Cu-pillarbumpingisanext-generationflipchipinterconnectionbetweenchip&packages(FCBGA/FCCSP),especiallyforfinepitchapplications.
32/32.Pillarbump:70umCopper+30umSn63/Pb37solder.Package:6x6mmTFBGA(molded/48ball).結語.現有的凸塊及組裝技術，應用於微間距覆晶技術時，仍有 ...
Copperpillarbump(CPB)technologyistoproduceabumponthesurfaceofFlipchippackagewhichhastheelectricandheatconductivityandtheresistance ...
CopperpillarbumpiswidelyusedformanytypesofflipchipinterconnectwhichoffersadvantagesinmanydesignswhilemeetingcurrentandfutureROHS ...
Features·Availablewafersize:12inches(300mm)·Cleanprocessprovidedbyfluxlessreflowtechnology·Low-alpha-raySn-Agsolderplatingissupported ...